Technical References: PermiNex™

 

2017

(WB-17-01) Characterization of a new adhesive for wafer bonding
A. Draisey (Applied Microengineering Ltd. (AML), Harwell Campus, Oxforshire, United Kingdom)
WAFERBOND Conference 2017 - Leuven, November 29, 2017


2016

(WB-16-01) Optical properties and real application of new photoimageable bonding adhesives
W. Kubicki, R. Walczak, J. Dziuban
Wroclaw University of Science and Technology, Janiszewskiego St. 11/17, Wroclaw, 50-372, Poland
Procedia engineering, 168, 1402-1405, 2016

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