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MicroChem Negative Epoxy Resists

MicroChem epoxy resists consist of chemically amplified, epoxy-based negative resists that are highly functional, and photo-imageable to near UV (365nm) radiation. Cured films or microstructures are very resistant to solvents, acids and bases and have excellent thermal and mechanical stability, making them well suited for fabricating permanent structures such as pixel walls, fluidic channels and nozzles, micro arrays and spacers.

Epoxy Resists Features UV
Sensitivity
Film Thickness
(optimum)
Resolution

    SU-8 Product Line

SU-8
  • Wide range of viscosities
  • High aspect ratio patterning
  • Photo-definable ultra-thick structures

i-line

10-200 µm
>10:1 Aspect Ratio
SU-8 2000
  • Improved substrate wetting
  • Faster drying
  • Higher process throughput

i-line

10-100 µm
>10:1 Aspect Ratio
SU-8 3000
  • Improved substrate adhesion
  • Reduced coating stress

i-line

10-70 µm
>5:1 Aspect Ratio
SU-8 TF 6000 SU-8 TF 6000
  • High resolution thin film processing
  • Highly uniform thin films
  • Improved substrate adhesion

g-, h-, i-line 0.5-10 µm High resolution

    KMPR® Product Line

KMPR® 1000
  • Temporary or permanent applications
  • TMAH (0.26N) development
  • Electroplating and etch mask

i-line

2-75 µm

>5:1 Aspect Ratio







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