Developmental Products

MicroChem Corp. continuously focuses the extensive knowledge and capabilities of its experienced R&D team of chemists, engineers, and electronic materials technologists on the development of innovative chemical solutions to meet the evolving technical challenges of the MEMS and microelectronics industries.


PermiNex™ Photo-Imageable Wafer Bonding Adhesives

  • Permanent wafer bonding adhesives for non-hermetic applications
  • Low temperature processing
  • Expected commercialization Q2 2016

PriElex® Jettable Polymeric Materials

  • Functional inks for inkjet printing of electronic devices
  • XP PriElex® SU-8 1.0 suitable for the FUJIFILM Dimatix DMP printer

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