MicroChem's partnership with Dow Electronic Materials spans 20 years.
It is a relationship that integrates distribution, licensing, and value-added services in semiconductor and advanced packaging electronic materials — from front end to back end.


Semiconductor Technologies
Broadband resists for wet etch including the S1800®, S1800®G2, and SPR™3000 series
Advanced i-line resists (3-10μm) including SPR™955-CM, SPR™220, SPR™660, SPR™3600M
Positive DUV resists including UV™210GS and UV6™, and UV™26. Also available: UV26G-2.5 in quart containers.
Lift-off Layers LOL™1000 and 2000
Ancillary materials including developers, EBR products and removers
Advanced Packaging Technologies

Download the Advanced Packaging Polymers Product Selection Guide

Thick resists including InterVia™ BPR™-100 and BPN-65
Electrophoretic resists including InterVia™ 3D-N and InterVia™ 3D-P
Dielectrics including InterVia™ 8023, Cyclotene 3000, and Cyclotene 4000 - Immersion Develop and Puddle Develop
Ancillary materials including developers, EBR products and removers




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