InterVia BPR™-100 Thick Photoresist
Negative photoresist for use in a wide variety of plating and etching processes used in wafer level packaging (WLP)
- Single-spin film thickness >100 microns
- Near vertical side walls
- Excellent adhesion to all WLP substrates; excellent chemical resistance.
- Dow Developers
- Dow Removers
- Plating: Thick Negative Tone
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