Products

InterVia BPR™-100 Thick Photoresist

Dow Electronic Materials
BPR™-100 Thick Photoresist

Negative photoresist for use in a wide variety of plating and etching processes used in wafer level packaging (WLP)

  • Single-spin film thickness >100 microns
  • Near vertical side walls
  • Excellent adhesion to all WLP substrates; excellent chemical resistance.

BPR™-100 Data Sheet

Ancillaries:

  • Dow Developers
  • Dow Removers

Applications:

  • Plating: Thick Negative Tone

MicroChem's distribution of Dow Electronic Materials semiconductor and advanced packaging electronic materials is supported by our value-added services founded on chemical and formulary knowledge, extensive applications experience, and process engineering expertise.

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