InterVia BPR™-100 Thick Photoresist

Dow Electronic Materials
BPR™-100 Thick Photoresist

Negative photoresist for use in a wide variety of plating and etching processes used in wafer level packaging (WLP)

  • Single-spin film thickness >100 microns
  • Near vertical side walls
  • Excellent adhesion to all WLP substrates; excellent chemical resistance.

BPR™-100 Data Sheet


  • Dow Developers
  • Dow Removers


  • Plating: Thick Negative Tone

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