InterVia™ BPN-65 Thick Photoresist
Negative photoresist formulated for wafer level bump plating
- Single-spin film thickness 30-140 microns
- Vertical side walls
- Excellent adhesion to all WLP substrates; excellent chemical resistance.
BPN-65 Data Sheet
- CD-26 Developer
- Dow Removers
- Plating: Thick Negative Tone
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