InterVia™ BPN-65 Thick Photoresist

Dow Electronic Materials
 INTERVIA™ BPN-65 Thick Photoresist

Negative photoresist formulated for wafer level bump plating

  • Single-spin film thickness 30-140 microns
  • Vertical side walls
  • Excellent adhesion to all WLP substrates; excellent chemical resistance.

BPN-65 Data Sheet


  • CD-26 Developer
  • Dow Removers


  • Plating: Thick Negative Tone

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