InterVia™ 3D-P Electrophoretic Photoresist
Negative photoresist emulsion that can be applied onto a wide variety of electrically-conductive substrates by anaphoretic electrodeposiiton
- Coating thickness capability from 2-10 µm
- Provides uniform, defect free coating
- Exposure at i-Line (365-405) wavelength
InterVia™ 3D-P Data Sheet
- Dow Developers
- Dow Removers
- General Lithography: Electrodeposition
- Advanced Packaging: Electrodeposition
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