InterVia™ 3D-P Electrophoretic Photoresist

Dow Electronic Materials
INTERVIA™ 3D-P Electrophoretic Photoresist

Negative photoresist emulsion that can be applied onto a wide variety of electrically-conductive substrates by anaphoretic electrodeposiiton

  • Coating thickness capability from 2-10 µm
  • Provides uniform, defect free coating
  • Exposure at i-Line (365-405) wavelength

InterVia™ 3D-P Data Sheet


  • Dow Developers
  • Dow Removers


  • General Lithography: Electrodeposition
  • Advanced Packaging: Electrodeposition

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