InterVia™ 3D-N Electrophoretic Photoresists
Negative photoresist emulsion that can be applied onto a wide variety of electrically-conductive substrates by cathodic electrodeposition
- Coating thickness capability up to 12.5 microns
- Provides uniform, defect free coating
- Resolution capability of 1:1
InterVia™ 3D-N Data Sheet
- Dow Developers
- Dow Removers
- General Lithography: Electrodeposition
- Advanced Packaging: Electrodeposition
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