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InterVia™ 3D-N Electrophoretic Photoresists

Dow Electronic Materials
INTERVIA™ 3D-N Electrophoretic Photoresists

Negative photoresist emulsion that can be applied onto a wide variety of electrically-conductive substrates by cathodic electrodeposition

  • Coating thickness capability up to 12.5 microns
  • Provides uniform, defect free coating
  • Resolution capability of 1:1

InterVia™ 3D-N Data Sheet

Ancillaries:

  • Dow Developers
  • Dow Removers

Applications:

  • General Lithography: Electrodeposition
  • Advanced Packaging: Electrodeposition

MicroChem's distribution of Dow Electronic Materials semiconductor and advanced packaging electronic materials is supported by our value-added services founded on chemical and formulary knowledge, extensive applications experience, and process engineering expertise.

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